We are the discerning I, the test lab of the future, established with a staunch purpose to build upon the cutting edge, leading edge ATE test development, load board development capability and provide the secondary extension of electrical test which is to validate a new product, a new process, or a new package.

Leading edge reliability complimented with high-end electrical test. We are accelerating the customer’s time to market deployment with rapid and accurate assessment of new products, existing technologies, mature products, and R&D projects

We are a futuristic reliability lab set up to offer wafer process and foundry qualification while qualifying package technologies in their worst-case use environment. Our unwavering expertise is to tailor your reliability plans and enable you to develop standard qualification guidelines expediting the quick market deployment in various business sectors. We specialize in ASICs, AASPs, Complex processors suited for the Automotive, Commercial and Military space, communication, radars, instrumentations, connectivity, artificial intelligence, digital signal processing and others. We are razor focused to get you to the market with the shortest, swiftest possible technology packaging validation, and assist you in getting acknowledged into the marketplace as a qualified product.

Our Qualification Plans are designed to target reliability efforts tailored to a specific technology and a customer in a specific application sector. To accentuate, what we offer is custom reliability plans, custom solutions, custom application conditions, custom and realistic ways of being able to do reliability testing with optimal sample sizes. We build upon the wafer data, the process data, the in-process data, the packaging data, the design data and design custom reliability quality plans to ensure your success in the shortest span of time.

Along with this, we are a lab that is focused on understanding the realities of no human contact electronic lab. A lab with key focus on electronic control of power supplies and media, voltage tolerances, temperature controls, thermal junction measurements, junction regulation, ambient regulation.

Our reliability instrumentation with all its tenacity, nurtures progression while a talented engineering group will strive effectively to provide unique custom solutions for each futuristic reliability evaluation.

We work with the customer and do quick validation of your design, quick ESD, quick latch up, quick thermal function tests followed by test for reliability acceptance. In addition to this, we will do a technology evaluation, limited qual, followed by a personalized plan to defining qual plans, sample sizes, reliability targets and the reliability predictions with failure rate calculations.

Our forte is to support cutting edge technology, ultra-high integration, ultra-high density, sub 14 nanometer technology where complexity and integration of the design, that is more like a System on Chip (SoC) or a System in Package ( Sip) requires very unique and creative reliability methodologies to be able to qualify and validate their technology.

We excel in:

Futuristic Package Evaluation, package in terms of size, validation, Thermal Moir ’e imaging, warpage analysis, structural analysis of a package, coefficients of TC thermal coefficients matching, materials matching, followed by reliability standards and benchmarks are our prized niche.