Where Form Factor, Thermal, and Materials become a Science!
Thermal Characterization
Thermal resistance Die to case and Die to Ambient
Flatness/warpage and Stress Analysis
Signal Integrity and TDR analysis
Suitability of Application and worst-case Environment Analysis
Moisture Sensitivity Classification
System in a Package evaluation as a system
Thermal Imaging and Thermal Symmetry Analysis
Ultra High Temperatures ≥ 200°C evaluation