Our specialty is to devise, and execute Process and Technology Qualification of Test Chips, Standard products, ASICs, FPGA’s Memories, and all other logic products.

Advanced capabilities of system level, device level, Component level reliability validation using functionality system level test, burn-in, and bench burn-in conducted at maximum possible ambient, maximum possible junction giving it the shortest fastest most accurate assessment using the techniques we deploy. Air burn-in, liquid burn-in, junction-managed burn-in, and system-level burn-in.

Building upon the process Wafer and Foundry Processing data a Qualification and characterization plan is devised that looks at Early Failure Rate and Long-Term Performance of technologies.

Foundry-specific tests and technological benchmarking, characterization tests, are designed with ATE test hardware, Reference board design, biasing and stress hardware, Burn-in, and HTOL Boards.

The centerpiece of this is our Life Test Burn in or HOTL Services:

Low power Dynamic

Static and functional Burn-in

Test during Burn-in

At speed intelligent Burn-in

Ambient low-power air flow managed Burn-in

Thermally-managed and junction-managed Burn-in

Real-time water/heater-controlled Burn-in for High Power dissipation

Reference card and System Level Test Burn-in

Level I and systems level II Burn-in

Power cycling and application-specific Burn-in

COTS Qualification & PEM & Qualification Services

On Going Reliability Monitors (ORM,s)

Advanced Chamber less Burn-in (RF device testing)

Specialty in HTOL/EFR Testing

• Leading edge technolog\ies require precision, accuracy, and real-time management during burn-in

• iTest deploys leading edge burn-in ovens complimented with smart data acquisition techniques to ensure technology evaluation is correctly performed

• iTest Designs and Develops Custom Boards for each design

• Customer Evaluation Board/Subset can be integrated on the Burn-in Board

• Extensive monitoring of device sign of life during Burn

• Real time junction monitoring and thermal regulation

• Signal integrity with true accurate factors

• Voltage and Current transient controls with added suppressant/capacitive controls

High Power Burn-In System

• 500 Watts Power Dissipation per single DUT position

• Sophisticated DUT level Power supply

• 100MHz Vector Rate (250MHz clock rate)

• FPGA based DUT level Pattern Generators — 128 channels

• DUT level Active Thermal Control with liquid

• DUT level Spike and Over temperature, V & I, protection

• DAQ for online monitoring and control of entire BI System

• System Level Burn-In

• Application Specific Life Test

• Level 1 and Level 2 Burn-In