Reliability Test Services 

Characterize devices for a wide array of electrical functions, mechanical and environmental stresses to ascertain accurate FIT rates.

Accelerated Evaluation & Qualification

Board-level Solder Joint Reliability

Device characterization / Feasibility Analysis

Multiple package/product evaluation

High-powered, liquid and RF burn-in

Acoustic Microscopy

EFR Analysis

Particle Impact Noise Detection (PIND)

Salt Atmosphere

Shadow Moiré/Warpage Analysis

Solderability

X-Ray

Other Level III & Sub System

Hermetic package testing 

Failure Analysis

Photography and Optical Microscopy

Radiography Inspection (X-Ray)

Cross-Section

Decapsulation

Scanning Electron Microscopy (SEM)

Energy Dispersive Spectroscopy (EDS/EDX)

Scanning Acoustic Microscopy

Emission Microscope (EMMI)

Dye & Pry